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List of semiconductor scale examples

Listed are many semiconductor scale examples for various metal–oxide–semiconductor field-effect transistor (MOSFET, or MOS transistor) semiconductor manufacturing process nodes.

Timeline of MOSFET demonstrations

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PMOS and NMOS

CMOS (single-gate)

Multi-gate MOSFET (MuGFET)

Other types of MOSFET

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Commercial products using micro-scale MOSFETs

Products featuring 20&nbsp;μm manufacturing process

Products featuring 10&nbsp;μm manufacturing process

Products featuring 8&nbsp;μm manufacturing process

Products featuring 6&nbsp;μm manufacturing process

Products featuring 3&nbsp;μm manufacturing process

Products featuring 1.5&nbsp;μm manufacturing process

Products featuring 1&nbsp;μm manufacturing process

  • NTT's DRAM memory chips, including its 64kb chip in 1979 and 256kb chip in 1980.
  • NEC's 1Mb DRAM memory chip in 1984.
  • Intel 80386 CPU launched in 1985.

Products featuring 800&nbsp;nm manufacturing process

  • NTT's 1Mb DRAM memory chip in 1984.
  • NEC and Toshiba used this process for their 4Mb DRAM memory chips in 1986.
  • Hitachi, IBM, Matsushita and Mitsubishi Electric used this process for their 4Mb DRAM memory chips in 1987.
  • Toshiba's 4Mb EPROM memory chip in 1987.
  • Hitachi, Mitsubishi and Toshiba used this process for their 1Mb SRAM memory chips in 1987.
  • Intel 486 CPU launched in 1989.
  • microSPARC I launched in 1992.
  • First Intel P5 Pentium CPUs at 60&nbsp;MHz and 66&nbsp;MHz launched in 1993.

Products featuring 600 nm manufacturing process

Products featuring 350 nm manufacturing process

Products featuring 250 nm manufacturing process

Processors using 180 nm manufacturing technology

Processors using 130 nm manufacturing technology

Commercial products using nano-scale MOSFETs

Chips using 90 nm manufacturing technology

Processors using 65 nm manufacturing technology

  • Sony–Toshiba EE+GS (PStwo) – 2005
  • Intel Pentium 4 (Cedar Mill) – 2006-01-16
  • Intel Pentium D 900-series – 2006-01-16
  • Intel Celeron D (Cedar Mill cores) – 2006-05-28
  • Intel Core – 2006-01-05
  • Intel Core 2 – 2006-07-27
  • Intel Xeon (Sossaman) – 2006-03-14
  • AMD Athlon 64 series (starting from Lima) – 2007-02-20
  • AMD Turion 64 X2 series (starting from Tyler) – 2007-05-07
  • AMD Phenom series
  • IBM's Cell Processor – PlayStation 3 – 2007-11-17
  • IBM's z10
  • Microsoft Xbox 360 "Falcon" CPU – 2007–09
  • Microsoft Xbox 360 "Opus" CPU – 2008
  • Microsoft Xbox 360 "Jasper" CPU – 2008–10
  • Microsoft Xbox 360 "Jasper" GPU – 2008–10
  • Sun UltraSPARC T2 – 2007–10
  • AMD Turion Ultra – 2008-06
  • TI OMAP 3 Family – 2008-02
  • VIA Nano – 2008-05
  • Loongson – 2009
  • NVIDIA GeForce 8800GT GPU – 2007

Processors using 45 nm technology

Chips using 32 nm technology

  • Toshiba produced commercial 32Gb NAND flash memory chips with the 32nm process in 2009.
  • Intel Core i3 and i5 processors, released in January 2010
  • Intel 6-core processor, codenamed Gulftown
  • Intel i7-970, was released in late July 2010, priced at approximately US$900
  • AMD FX Series processors, codenamed Zambezi and based on AMD's Bulldozer architecture, were released in October 2011. The technology used a 32&nbsp;nm SOI process, two CPU cores per module, and up to four modules, ranging from a quad-core design costing approximately US$130 to a $280 eight-core design.
  • Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in September 2011

Chips using 24–28 nm technology

  • SK Hynix announced that it could produce a 26&nbsp;nm flash chip with 64&nbsp;Gb capacity; Intel Corp. and Micron Technology had by then already developed the technology themselves. Announced in 2010.
  • Toshiba announced that it was shipping 24&nbsp;nm flash memory NAND devices on August 31, 2010.
  • In 2016 MCST's 28&nbsp;nm processor Elbrus-8S went for serial production.

Chips using 22 nm technology

  • Intel Core i7 and Intel Core i5 processors based on Intel's Ivy Bridge 22&nbsp;nm technology for series 7 chip-sets went on sale worldwide on April 23, 2012.

Chips using 20 nm technology

Chips using 16 nm technology

Chips using 14 nm technology

  • Intel Core i7 and Intel Core i5 processors based on Intel's Broadwell 14&nbsp;nm technology was launched in January 2015.
  • AMD Ryzen processors based on AMD's Zen or Zen+ architectures and which uses 14&nbsp;nm FinFET technology.

Chips using 10 nm technology

  • Samsung announced that it had begun mass production of multi-level cell (MLC) flash memory chips using a 10nm process in 2013. On 17 October 2016, Samsung Electronics announced mass production of SoC chips at 10&nbsp;nm.
  • TSMC began commercial production of 10&nbsp;nm chips in early 2016, before moving onto mass production in early 2017.
  • Samsung began shipping Galaxy S8 smartphone in April 2017 using the company's 10&nbsp;nm processor.
  • Apple delivered second-generation iPad Pro tablets powered with TSMC-produced Apple A10X chips using the 10&nbsp;nm FinFET process in June 2017.

Chips using 7 nm technology

  • TSMC began risk production of 256&nbsp;Mbit SRAM memory chips using a 7&nbsp;nm process in April 2017.
  • Samsung and TSMC began mass production of 7&nbsp;nm devices in 2018.
  • Apple A12 and Huawei Kirin 980 mobile processors, both released in 2018, use 7&nbsp;nm chips manufactured by TSMC.
  • AMD began using TSMC 7&nbsp;nm starting with the Vega 20 GPU in November 2018, with Zen 2-based CPUs and APUs from July 2019, and for both PlayStation 5 and Xbox Series X/S consoles' APUs, released both in November 2020.

Chips using 5 nm technology

  • Samsung began production of 5&nbsp;nm chips (5LPE) in late 2018.
  • TSMC began production of 5&nbsp;nm chips (CLN5FF) in April 2019.

Chips using 3 nm technology

See also

References